-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Smart Profiling System at NEPCON Shanghai – KIC SPS
March 22, 2017 | KICEstimated reading time: 2 minutes
KIC will introduce the new KIC SPS thermal profiler in China in Stand 1G12# at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center.
This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup.
The new thermal profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection & faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all-new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.
Additionally, the KIC Vantage smart thermal process system will be demonstrated. The KIC Vantage is an ecosystem that automatically acquires and delivers insightful information in real-time to allow factories to produce consistent quality at lower costs. The software is retrofitable and can work in conjunction with KIC’s profilers and automatic systems.
Freddie Chan, General Manager KIC Asia commented: "We are excited to launch two new smart oven products that will shape up to become the enablers for the new age of smart factory. Both KIC SPS and KIC Vantage will take reflow and wave solder automation to a whole new level. In a leap of technological progress, these two innovations elevate the ability to acquire profile data and optimize the soldering machines from the local machine to the factory level, which will enable users to mine the reflow data across the whole factory and make insightful decisions."
KIC looks forward to welcoming visitors to Stand 1G12# to celebrate the company’s 40-year anniversary of helping manufacturers improve quality and reduce costs through thermal process optimization.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC SPS, K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
For more information about KIC, visit www.kicthermal.com.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.