-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Vitronics Soltec Products Win Two SMT China Vision Awards in Reflow and Selective Soldering Categories
May 1, 2017 | Vitronics SoltecEstimated reading time: 2 minutes
ITW EAE’s Vitronics Soltec earned two coveted VA Excellent Awards from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The CATHOX Catalytic Thermal Oxidizer was recognized in the Reflow Soldering category and the ZEVAm took the prize in the Selective Soldering category.
The Catalytic Thermal Oxidizer (CATHOX) is an advanced system for keeping SMT reflow ovens clean and free of contamination. A nanomaterial-based catalyst system thermo-chemically decomposes organic materials outgassed from solder paste, bare boards and components. The nanotechnology makes it possible to change the chemical composition at temperatures around 250ºC. It is very effective in removing volatile compounds from the process tunnel during reflow. In thermal oxidation, organic vapors are converted to hydrocarbons, which are captured by a filter.
“CATHOX technology significantly reduces maintenance,” said Ton Colijn, ITW EAE Soldering Solutions Business Manager. “Increased production pressure, miniaturization, and implementation of pin-in-paste increase the consumption of solder paste which typically requires more maintenance in a reflow machine. The innovative CATHOX technology is increasing uptime approximately 10one hundred percent.”
The ZEVAm Selective Soldering system features patented technology that excels at meeting the challenges of miniaturization. High-frequency drop-jet fluxing technology allows for faster robot movement and a shorter cycle time. After running through the preheater, boards are transferred into a separate conveyor unit that can be tilted in x or y direction. The board is tilted and dragged over the wave. The tilting up or down from 4 to 10 degrees parallel and/or perpendicular to the conveyor makes solder joints accessible from all directions. The solder pot can also turn 360º. This tilt and rotate ability makes it possible to solder fine pitch connectors using non-wettable as well as wettable nozzles. Together with a solder drainage conditioner bridges on fine pitch connectors will be removed.
“ZEVAm is preparing our customers for the challenges in fine pitch selective soldering” said Ton Colijn, ITW EAE Soldering Solutions Business Manager. “The ability to solder under an angle has a proven benefit for fine pitch components and provides more flexibility to program for tight ‘keep out’ areas.”
About ITW EAE
ITW Electronics Assembly Equipment (a division of Illinois Tool Works, Inc.), is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together the world’s leading brands of electronics assembly equipment: MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions and Despatch Thermal Processing Technology. For more information visit www.itweae.com.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.