-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Register Now for European Zuken Innovation World
May 17, 2017 | ZukenEstimated reading time: 1 minute
If you haven’t yet inked a date for your local European ZIW conference, then it's about that time. This your one chance to be part of the annual gathering of the electrical and electronic design community in a European city near you. Take advantage of the following opportunities at your local ZIW show:
- Networking
- Information sharing
- Catching up with old friends/colleagues
It’s also the best place to get a comprehensive update on where Zuken is going as a company on a global, regional and local level, in your own language.
- Our focus on customer challenges and next generation business and design issues
- Our investments
- Our commitment to innovation
You’ll also get product visions across the electrical and electronic design environment. We don’t publish these anywhere so you can only see them in person for:
- CR-8000
- CADSTAR and Next Generation CADSTAR
- E3.series
Finally, it’s your chance to listen to other users talk first-hand about their experiences using Zuken software. You can’t get that sort of candid discussion and learning opportunity online.
So take the chance to go live. You never know what you’ll learn.
Here are the dates for your calendars.
- Disney (Marne La Vallée), France – June 8
- Bologna, Italy – June 13
- Feusisberg/Zurich, Switzerland – June 26
- Coventry, United Kingdom – September 27
Don’t miss out!
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.