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Connect the Dots: Designing for Reality—Lamination and MaterialsReal Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
May 1, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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