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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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IPC's Vision for Empowering PCB Design Engineers
April 30, 2024 | Robert Erickson, IPCEstimated reading time: 1 minute
As architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
Setting the Stage for Success
All except the youngest of us remember when telephones were only for talking, and a refrigerator didn’t do much at all. Today, traditionally mundane devices like refrigerators, doorbells, and thermostats include advanced electronic components that offer connectivity, smart features, and the ability to communicate. These and the thousands of other devices that make our modern way of life possible rely on printed circuit boards and the skilled individuals who design them.
These designers need to keep up with the latest developments in PCB design as it evolves in tandem with the increasingly complex components required to deliver the functionality provided by this wide variety of products. IPC fulfills this need by providing comprehensive training that helps designers gain a deep understanding of PCB design principles, industry best practices, and emerging technologies. From foundational courses like PCB Design I and PCB Design II to advanced offerings such as PCB Design for Manufacturability and PCB Design for Advanced Packaging, IPC's curriculum covers the wide range of skills required to achieve success in PCB design.
To read this entire article, which appeared in the April 2024 issue of Design007 Magazine, click here.
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IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.