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Ventec’s Martin Cotton to Speak at Advancements in Thermal Management Conference 2017
August 2, 2017 | VentecEstimated reading time: 1 minute
 
                                                                    Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, will present a paper on Advanced IMS Material Solutions at the Advancements in Thermal Management Conference from 9-10 August 2017 in Denver, Colorado, USA.
 
 Martin Cotton, Ventec’s Director of OEM Technology will be presenting his technical paper entitled ‘Advanced Thermal Material Solutions’ on Wednesday, 9 August at 11am at the DoubleTree by Hilton Denver Tech Center.
 
 Thermal issues in printed circuit boards and their related assemblies are becoming as important as the signal integrity in the design and manufacture of PCBs. The relationship between the materials used and the thermal functionality is a key focus as industry sectors tackle issues of reliability, aging and functionality. Costs and the value analysis between thermal transfer rates and materials used are fast becoming a design discipline that has huge effects on final assembly cost and thermal functionality.
 
 Martin’s presentation introduces new generation materials, their background and what current solutions are being used by various market sectors. Discussion on the next generation of insulated metal substrates (IMS) and prepregs for printed circuit boards and hybrid constructions will be covered. Design and the value analysis required to lower cost in the final assembly while maintaining thermal function will be reviewed. Finally, the myths and misunderstandings around thermal materials and how to use them will be explained.
 
 Martin will be joined by Jack Pattie, President of Ventec USA.
 
 About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the U.S. and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
 
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Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
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