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iNEMI to Hold Roadmap Webinar on Packaging and Component Substrates
August 29, 2017 | iNEMIEstimated reading time: Less than a minute
New architectures and platforms are emerging to populate cloud infrastructures. Because of this, packaging technologies will be required to provide higher performance, lower power, increased physical density of bandwidth and decreased latency — all at no increase in cost.
The 2017 iNEMI Roadmap chapter on packaging and component substrates is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.
The webinar will be held on August 30, 2017, and will be presented by Bill Bottoms (3MTS), Chair, Packaging & Component Substrates TWG, 2017 iNEMI Roadmap.
For more information or to register, click here.
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IPC's Vision for Empowering PCB Design Engineers
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Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
epoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
04/29/2024 | epoxySetepoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.