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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
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EIPC SpeedNews: News from the European PCB Industry
September 4, 2017 | EIPCEstimated reading time: Less than a minute
- EIPC Member's Job Vacancies
- Atotech Presents Study Results of Pd Initiation in ENEPIG at the InterPACK 2017
- FED Conference September 21–22
- Smartphone Growth Expected to Remain Positive as Shipments Forecast to Grow to $1.7B in 2021
- Reliability and Process Trouble Shooting with SMART Group Events
- ICT Evening Seminar, Newtown House Hotel, Hayling Island, September 19
- Ventec Highlights Advanced Thermal Management Solutions at Electric & Hybrid Vehicle Technology Expo
Suggested Items
Real Time With… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
epoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
04/29/2024 | epoxySetepoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
epoxySet Introduces EO-20E – Versatile, Electrically Conductive Epoxy
04/29/2024 | epoxySetepoxySet produces EPOXIOHM EO-20E an industry established, reliable electrically conductive epoxy designed for solder replacement, chip bonding and other intricate electronic and optoelectronic assemblies. This creamy paste has a an easy to use 1:1 mix ratio with a 48 hour work time.
Adura Solutions Exhibits at Del Mar 2024
04/24/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year’s Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.