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Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225

04/25/2024 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:

Altus Group Achieves Record Sales Milestone with Koh Young Europe

03/26/2024 | Altus Group
Altus Group, a leading supplier of capital equipment for the electronics industry, has announced a significant milestone in partnership with Koh Young Europe (KYE).

Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024

03/19/2024 | MEK
Mek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.

Solderstar to Spotlight the Reflow Shuttle with O2 at IPC APEX EXPO 2024

03/11/2024 | SolderStar
Solderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.

Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 3

03/01/2024 | I-Connect007 Editorial Team
Chapter 3 of this book is titled Thermal Resistance/Impedance and Measurement. To assess a vendor’s claims about the performance of an IMS, it is important to know the test method that has been applied. Designers may need to rely on empirical data and past experience to develop an IMS specification to meet their needs.
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