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Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 3
March 1, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Chapter 3: Thermal Resistance/Impedance and Measurement
Note that several measurement methods are in common use and typically produce different results. Obviously, this can cause confusion. The Rth value of a thermal resistance, or its thermal conductivity, is meaningless if the test method is not specified.
Following is a brief review of the different measurement methods:
ASTM E1461
The image on the left in Figure 3.1 shows the experimental setup and measurement principle for the test method ASTM E1461 (Standard Test Method for Thermal Diffusivity by the Flash Method). This is a contactless test method for high-temperature testing using a laser. One surface of the test sample is irradiated with a flash of the laser and the thermal transfer to the other side is measured using an infrared detector.
A test sample measured according to ASTM E1461 was shown to have thermal conductivity of 3.3 W/mK.
ISO 22007-2
The center diagram in Figure 3.1 describes the test setup and measurement principle for testing according to the ISO 22007-2 transient plane heat source (hot disc) method. This method allows fast testing and high accuracy, eliminating opportunities for measurement failures and yielding a value without transfer losses. The test sample needs to be at least 3 mm thick.
Using this setup to test the same sample as in the previous ASTM E1461 test showed the thermal conductivity to be 5 W/mK.
ASTM D5470
The diagram on the right in Figure 3.1 describes the test method ASTM D5470. A heat flow is set up through the sample, establishing a temperature gradient that is measured in the steady state. The thermal conductivity/resistance of the sample is then calculated using a method described in the standard.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
Unlocking the Promise of AI in Electronics Manufacturing
10/29/2025 | Shobhit Agrawal, Keysight TechnologiesThe electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
HT Global Circuits Adds Two atg Luther & Maelzer Flying Probe Test Systems
10/15/2025 | atg Luther & Maelzer GmbHAtg Luther & Maelzer GmbH, a leading supplier of electrical testing solutions for the PCB industry, and IEC USA, a distributor of consumables, equipment, and services in the North American PCB market, confirm the order for high-speed bare board testing technology.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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