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Alpha Solder Preforms Prevent Die Tilt with Consistent Bondline Thickness
October 31, 2017 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions is introducing ALPHA TrueHeight Preforms, a solder preform engineered with embedded spacer technology that can address all major applications requiring 75µm bondline and above.
ALPHA TrueHeight Preforms are engineered with simplicity in mind to allow ease of implementation and maximum soldering performance. The architecture of the design not only addresses the bondline thickness requirement, but also reduces the opportunity for voiding. The design minimizes areas where gases can be trapped, compared to other technologies, during the reflow process.
"Engineers can be confident of achieving their design goals during manufacturing when using ALPHA TrueHeight Preforms," said Eric Poh, Regional Product Manager for Solder Preforms at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. "TrueHeight Preforms have the advantage of flexible spacer positioning, so strategic locations can be chosen to ensure consistent bondline thickness."
ALPHA TrueHeight Preforms can be flux coated as well from a wide selection of fluxes.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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