-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
IEEE’s Romanian SIITME Show a Success
January 9, 2018 | Joe Fjelstad, Verdant ElectronicsEstimated reading time: 2 minutes
The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, October 26-29, 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda (who prototyped an early jet aircraft in 1910), and great engineers like Anghel Saligny, and George Constantinescu, a pioneering scientist credited with developing the theory of sonics.
The convention was created to bring together members of the electronic packaging community from near and far to discuss technology developments and needs. Ongoing efforts by the organizers have been intensified over the last decade in their effort to bring together academia and industry to share knowledge and experiences. The SIITME conference creates a shared environment where students, teachers, and senior researchers present their latest works and interact with industry representatives who highlight the state-of-the-art in the industry.
As Professor Dan Pitica of the Technical University of Cluj Napoca, Romania, observed, “SIITME is more than a just a conference. The Association for Promoting Electronics Technology, APTE, succeeded in bringing together eight top international professionals to give keynote talks including Klaus-Jurgen Wolter (Technische Universitat Dresden, Germany), Gheorghe Brezeanu (Politehnica University of Bucharest, Romania), Stefan Techau (ASM Assembly Systems GmbH & Co KG), Frederic Kratz (National Institut of Applied Sciences INSA, Centre Val de Loire, France), Joseph Fjelstad (Verdant Electronics, USA), Jose Sartori (OSRAM Opto Semiconductors), Etienne Sicard (INSA Toulouse, France), Radu Sporea (Advanced Technology Institute, University of Surrey, Guildford, UK), and many specialists from Continental Automotive, Tecnometal (Italy), ES Srl Electronic Solution (Italy), SEM Communication & GEST Labs SRL (Italy), Comtest, Miele Tehnica, NTT Data.”
To focus on the future, the first day of the event was dedicated to the Industrial Workshop “Advanced Interconnection and Disruptive Technologies, Debate for the Future Sustainable Electronics Packaging.” This event was moderated by industry representatives Cosmin Moisa, Continental Automotive Romania; Stefan Techau; Paul Svasta, University Politehnica of Bucharest; and myself. Topics included the reliability challenge for the electronic products, front-end assembly capability, managing PCB supplier challenges, and CETTI’s early steps in exploring Occam technology were also discussed.
To read this entire article, which appeared in the December 2017 issue of The PCB Design Magazine, click here.
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.