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Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
April 25, 2024 | I-Connect007Estimated reading time: 1 minute
In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department. Listeners will also learn about the critical relationship between design choices and manufacturing capabilities, as well as subsequent steps of metalizing the drilled holes through an electrolysis process.
This series is all about the specifics that can affect your circuit board during the manufacturing process and includes tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is committed to providing digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of exclusive content for the global electronics industry.
Click here to listen to episode 5 of On the Line With: Designing for Reality. Visit our educational resource center to access more free content.
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Sweeney Ng - CEE PCBSuggested Items
Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/26/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.