-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
That’s Hot: Ventec’s Goodwin on Thermal Management
January 3, 2018 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. I sat in on some subcommittee meetings, including one on laminates, where I met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.
Patty Goldman: Good to see you, Mark. How about we talk about thermal management?
Mark Goodwin: Yes, let’s. From our perspective, there are really two material sets that we consider for thermal management. There's the IMS (insulated metal substrate) materials, the metal-back materials, which started off as an LED lighting story. But it's much, much more than an LED lighting story now, particularly with the development in e-vehicles and hybrid vehicles. There's a lot of e-powertrain, so heavy current moving power around in cars.
The second strand is a new direction for us and the technology is a thermally conductive thin core material, thermally conductive prepreg for building multilayers with thermal conductivity or using those layers and those prepregs in standard multilayer constructions, but as a hybrid, so only putting the thermal management where you need to put it.
Goldman: So, is it sort of somehow self-cooling, then?
Goodwin: The materials have a thermal capacity. They can take heat away from embedded components. For example, people using coin technology (embedding a metal inside the PCB under the high-power components so that heat can be dissipated) may not need to use that, or maybe they can use it in conjunction with thermally conductive prepregs, thermally conductive cores. As a company, we’re publishing an eBook through I-Connect007 on thermal management and the materials for thermal management. It's predominantly an IMS story, but there is some discussion in there about the new materials, thin cores and prepregs, and our thinking about thermal management. So that's thermal resistance and thermal impedance compared with thermal conductivity. There's a lot of confusion, particularly at the design stage, I believe.
Goldman: Thermal management seems to encompass a rather broad area. You must separate the parts.
Goodwin: When we talk about thermal management, we're talking about getting the heat out of components, be that an LED chip, or be that an embedded ‘whatever’ in a multilayer circuit board.
Goldman: Does this facilitate embedding?
Goodwin: Yes, the new materials do.
To read this entire article, which ran in the December 2017 issue of The PCB Design Magazine, click here.
Suggested Items
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
North American EMS Industry Down 4% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.
Real Time with… IPC APEX EXPO 2024: A Global Presence in PCB Manufacturing
04/29/2024 | Real Time with...IPC APEX EXPORob DiGiovanni, VP of sales for the Americas at STARTEAM Global, discusses the company's global presence in PCB manufacturing. As he explains, the firm operates facilities across Europe, Asia, and North America, specializing in serving contract manufacturers in the automotive and medical industries. They emphasize quality and meeting OEM standards, focusing on offshore supply and non-Chinese factories in the North American market. The company has grown through acquisitions and rebranding to offer multiple products.
EIPC Issues Letter of Urgency
04/29/2024 | Alun Morgan, EIPCAlun Morgan, president of EIPC, issued a letter last week in an effort to raise awareness of the state of PCB manufacturing in Europe. He writes, "The European PCB manufacturing industry and its supply base has been steadily shrinking since the dot com crash at the start of the millennium. European demand for PCBs and assemblies has, however, continued to grow, thus creating an ever-widening gap between European domestic capacity and consumption. The risks posed by this imbalanced supply and demand pattern came into sharp focus during the Covid-19 pandemic which caused chaos in extended supply chains across the world and resulted in widespread shortages."