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iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series

09/19/2024 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.

Cincoze Rugged Embedded Computers: Driving Innovation in Edge AI Applications

09/12/2024 | BUSINESS WIRE
Rugged embedded computer brand—Cincoze, recognizes the huge application opportunities brought on by the edge AI trend and has five series across two product lines to fully meet the extreme performance, reliability, and environmental adaptability requirements of edge AI applications.

iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita

09/09/2024 | iNEMI
iNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.

Indium to Showcase Durafuse Solder Technology at Productronica India

09/02/2024 | Indium Corporation
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its innovative Durafuse® solder technology at Productronica India, September 11-13, in Delhi, India.

Indium to Highlight High-Reliability Solder Solutions at SMTA Guadalajara

08/28/2024 | Indium Corporation
Indium Corporation® will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September 11-12.
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