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RTW NEPCON China: Christian Koenen Stencil Technologies Ensure First Pass Yields
May 29, 2018 | Real Time with... NEPCON ChinaEstimated reading time: Less than a minute
Almost 70% of PCB assembly defects come from the solder paste printing process. The stencil is a key factor in this process because its tolerances and apertures affect the paste transfer efficiency, which in turn is among the main cause of failures down the line. In this interview, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve this process and ensure first pass yields.
Suggested Items
KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum
04/25/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Ciudad Juarez Expo & Tech Forum, scheduled to take place Thursday, May 9, 2024 at the Injectronic Convention Center in Ciudad Jaurez, Chihuahua, Mexico. During the event the KYZEN Clean Team will focus on understencil cleaning products KYZEN E5631J and CYBERSOLV C8882.
Europlacer Announces Introductory Promotions for 2024 IPC APEX EXPO
03/27/2024 | EuroplacerEuroplacer, a leading provider of SMT assembly solutions, is excited to announce special introductory promotions for its latest products at the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
GEN3 to Demo SIR Testing, Stencil Cleaning & More with Horizon Sales at IPC APEX 2024
03/07/2024 | Gen3Gen3, global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. At booth 3934, GEN3 will be exhibiting alongside Horizon Sales, presenting a lineup of advanced technologies aimed at enhancing the efficiency and reliability of circuit assembly processes.
AAT's Patented Rotational Spraying Method Ensures Superior Cleaning Performance
03/07/2024 | Austin American Technology (AAT)Austin American Technology (AAT) is pleased to announce that its patented rotational spraying method ensures superior cleaning performance, delivering consistent results for critical electronic components.
StenTech’s Photo Stencil Specialized Products Division Facility Update Completed
02/27/2024 | StenTechStenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.