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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Zuken's Tech Tip: Controlling Intelligent Layers in E3.series
June 5, 2018 | ZukenEstimated reading time: 1 minute
In the E3.series, levels are used to make certain things in your project—symbols, symbol graphics, symbol text, empty text, graphics, text, and connections—visible or invisible with the click of a button.
To view this video, click here.
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Simon Khesin - Schmoll MaschinenSuggested Items
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.
Netherlands Awards RTX $627M Patriot Defense Contract
04/13/2026 | RTXRaytheon, an RTX business, was awarded a $627 million contract to supply the Netherlands with Patriot® air and missile defense system equipment.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.
Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs
03/25/2026 | Agileo AutomationAgileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.