It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
ESI’s CapStone FPCB System Delivers Highest Via Drilling Throughput in Industry
October 8, 2018 | ESIEstimated reading time: 1 minute
Electro Scientific Industries, Inc. announced the availability of its new CapStone flexible printed circuit board laser processing system, which offers 2X throughput improvement over its predecessor for processing blind and through hole vias—the highest in the industry.
“Flexible printed circuit (FPC) manufacturers will get a significant advantage with CapStone,” said John Williams, ESI’s vice president of marketing. “Our marketing and engineering teams focused on the areas that would make the biggest impact on our customers’ productivity, pairing our newest beam control capabilities with the latest laser technology to deliver substantial gains. Doubling throughput not only enables FPC manufacturers to meet aggressive production schedules, but also allows them to add capacity with a smaller factory footprint, less capital expenditure and less recurring expense. This efficiency gain will drop right down to our customer’s bottom line.”
CapStone helps manufacturers keep pace with evolving technology requirements, such as the increasing use of blind vias and next-generation flexible materials. ESI’s new DynaClean beam positioning feature, enabled by its patented esiLens technology, reduces unproductive beam movement and provides multiple focus settings at every location. ESI’s newest-generation beam positioning technology, AcceleDrill, takes advantage of the high power and high repetition rate of the esiFlex laser to deliver unprecedented processing efficiency. Combined, these technologies allow FPC manufacturers to double their processing throughput without compromising quality, substantially lowering per-panel processing costs while maintaining high yields across a range of applications.
“The new CapStone solution leverages our extensive intellectual property portfolio and laser-material interaction expertise developed over several decades of experience in laser-based PCB processing. It expands our product offering to address important emerging applications in flex PCB manufacturing,” said Williams. “We expect the CapStone system to meet our customers’ needs well into the future.”
About ESI, Inc.
ESI’s manufacturing systems are designed to enable manufacturers of electronic components and devices to optimize their production capabilities and commercialize technologies through laser processing. ESI’s systems deliver more control, greater flexibility and more precise processing of a wider range of materials. The result is higher production quality, faster throughput, and higher yields, allowing customers to more easily meet new and challenging customer requirements, consistently meet aggressive production goals and better control costs. ESI is headquartered in Portland, Oregon, with global operations from the Pacific Northwest to the Pacific Rim. More information is available here.
Share on:
Suggested Items
SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
11/26/2024 | SMTAThe SMTA is excited to announce the technical program for the 2nd annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.