Smartphones' High Screen-to-Body Ratio to Become Mainstream
November 8, 2018 | TrendForceEstimated reading time: 2 minutes
According to WitsView, a division of TrendForce, the market has witnessed stronger demand for full-screen smartphones while higher screen-to-body ratio has become a major trend of this year. In order to make bezels narrower, drive ICs for mid- and high-end phones have been switching from solutions based on chip-on-glass (COG) packaging to those on chip-on-film (COF) packaging. With major smartphone vendors actively adopting COF solutions, the percentage of models using COF packaging would account for 35% of the global smartphone market in 2019, a significant increase from 16.5% in 2018.
“In the past, most driver ICs used in smartphones adopted COG packaging, which requires more room at the bottom of display panel for chip bonding, so the bottom bezel is normally larger than side bezels and top bezel”, says Boyce Fan, research director of WitsView. However, the recent bezel-less trend on smartphones has shaped the design of panels. High-end models have started to use COF package, in which driver IC is moved to the back of display panel, thus enabling a narrower bottom bezel. WitsView notes that COF package is only used in flexible AMOLED panels previously but will see higher penetration this year after Apple adopted this packaging technology in its 2018 new models. Other brands are expected to follow suit for their high-end models.
However, the stronger demand for COF package has resulted in a tight supply of tape, a necessary material for this packaging technology. The tapes have also seen rising quotes, which are rare in recent years. In the past, tapes are only used in large size COF panels, thus remaining in oversupply for a long time. Despite the rising number of high-end smartphones using COF packaging, WitsView does not discount the possibility that smartphone designers return to COG packaging because COF will increase the material costs for smartphones. For example, FHD+ 6MUX TDDI IC, which is currently in development, adopts COG packaging rather than COF. Considering the demand uncertainty, tape manufacturers may not be very active to expand production capacity.
With little production expansion yet higher demand for COF package from smartphone vendors, WitsView expects the COF substrates to see a tight supply. As the result, large size panel makers and smartphone makers may need to compete to secure the supply of COF substrates.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing.
Suggested Items
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.