-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Estimated reading time: 1 minute
Contact Columnist Form
Brooks' Bits: Internal Trace Temperatures—More Complicated Than You Think
Co-authored by Dr. Johannes Adam, founder of ADAM Research
IPC-2152, published in 2009, was the most thorough study of trace current and temperature relationships ever undertaken. It contains over 90 pages and charts that examine the relationships from numerous directions. Before IPC-2152, the industry used a set of charts that went back to a National Bureau of Standards (NBS) Report #4283 published in 1956. The charts were first published as a part of MIL-STD-1495 in 1973. They were later published in a subsequent series of standards that culminated in MIL-STD-275E in 1984. Further, the charts were published as part of IPC standard IPC-D-275, and IPC-2221A in 2003.
One of the most interesting findings in IPC-2152 was that internal traces are cooler than external ones for the same size and current. Independent experimentation was not done on internal traces in earlier charts. Internal traces were merely assumed to be hotter than external traces, and the external trace data was derated by 50% by that assumption.
Traces are heated by Joule, or I2R, heating. They are cooled by a combination of conduction through the dielectric, convection through the air, and radiation. It had previously been assumed that convection conducted heat away from the traces and cooled the traces more efficiently than conduction through the dielectric. Hence, the assumption that internal traces were hotter than their external trace counterparts. It turns out that dielectrics cool traces more efficiently than does convection plus radiation, and internal traces are relatively cooler.
One question is, “Is there a predictable relationship between the external temperature of a trace and the internal temperature of the same trace carrying the same current?” That is, is the internal trace 10% cooler, 20% cooler, or is there another predictor we can use to predict internal temperatures? The data in IPC-2152 makes it possible to explore this question. Internal and external temperature curves are provided for 1.0-, 2.0-, and 3.0-oz. traces and a variety of trace widths, so these relationships can be explored directly.
To read this entire column, which appeared in the October 2018 issue of Design007 Magazine, click here.
More Columns from Brooks' Bits
Brooks' Bits: Electromagnetic Fields, Part 3 - How They Impact CouplingBrooks' Bits: Electromagnetic Fields, Part 2: How They Impact Propagation Speed
Brooks' Bits: How Electromagnetic Fields Determine Impedance, Part 1
Trace Currents and Temperature, Part 4: Via Heat
Trace Currents and Temperature, Part 3: Fusing Currents
Trace Currents and Temperature, Part 1: The Basic Model
The Skinny on Skin Effect, Part 3: Crossover Frequency
Brooks' Bits: The Skinny on Skin Effect, Part 2