-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Saki to Demo 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX EXPO
January 8, 2019 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, California, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.
Saki's 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.
Demonstrations of Saki's new version of Saki Self-Programming Software (SSP), the inspection industry's first self-programming software, will be given. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated.
New at IPC APEX is Saki's 2D Bottom-side AOI System. Saki's proprietary 2D high-speed imaging technology scans an entire 460 x 510mm printed circuit board assembly in one pass, capturing its image on-the-fly, in real time, storing the image into memory, and creating inspection data for the entire board. Saki's bottom-side AOI system ensures PCB quality after dip, selective, and wave soldering. The system completely automates bottom-side inspection, including pin through-hole fillets. It's fast, cost-effective, and eliminates the need for flipping the PCB.
Saki's new 3D SPI system has a 12 megapixel camera for the fastest inspection and highest resolution with high accuracy and repeatability. It offers closed-loop functionality and 2D & 3D inspection using an LCoS imaging system. It is compatible with Saki's 3D AOI hardware and comes with Saki Self-Programming Software.
Previews will also be given of Saki's new 3D AXI system. The system benefits from the technology advancements of Planar Computer Tomography that perfectly separates top and bottom sides of the PCB and takes continuous 3D images without joints. With a programmable resolution from 13-30µm and best-in-class Cpk and gage repeatability and reproducibility, it delivers 100% head-in-pillow detection. Saki's AXI has been employed in the semiconductor industry for inspection and measurement of insulated gate bipolar transistors (IGBTs) and land grid arrays (LGAs).
"The past year has seen lots of changes, growth, and new equipment and technologies at Saki," said Satoshi Otake, general manager of Saki America. "We are excited to share our news and developments with the electronics community.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.