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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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RTW IPC APEX EXPO 2019: A Conversation with Burkle’s David Howard and Kurt Palmer
February 6, 2019 | Real Time with...IPCEstimated reading time: Less than a minute

Burkle North America's David Howard has chosen to take a well-earned retirement, and introduces Pete Starkey to his worthy successor Kurt Palmer.
To watch the interview, click here.
Suggested Items
AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben
06/04/2025 | AT&SAT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
My Top 10 Highlights from IPC APEX EXPO 2025
04/03/2025 | Chris Mitchell, IPC VP, Global Government RelationsEvery year, I am reminded what an exciting and fast-paced whirlwind IPC APEX EXPO is—the friends you run into, the new people you meet, the innovations you encounter, and the fascinating discussions you dive into. It’s certainly true that our industry is driven by searchers and problem-solvers, creating endless opportunities at APEX EXPO to connect, collaborate, and shape the future.
Calling All Designers: The Latest Design Technology and AI
03/20/2025 | Andy Shaughnessy, Design007 MagazineAdvanced design technology and AI were in the spotlight at the annual Design Town Hall, held March 19 during IPC APEX EXPO 2025. Speakers included IPC’s Peter Tranitz, Matt Kelly, Devan Iyer, as well as a panel on the use of AI in PCB design moderated by Susan Kayesar of Siemens.
Peter Mümmler to Become New CFO at LPKF
01/20/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics SE is pleased to announce that Peter Mümmler will be joining the Management Board as Chief Financial Officer with effect from 1 April 2025, with an initial contract term of 3 years.