-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Mentor Webinar April 11: How to Model Thermal Vias
April 2, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
In electronics product design, PCB thermal management that ensures adequate component cooling is important for reliability. Demands for compact designs and reduced costs drive a need for accurate and early evaluation of cooling options during design ideation phase.
Thermal vias offer opportunities to enhance heat dissipation away key components on a PCB. Register now for a new webinar on April 11, 2019, and learn how to model thermal vias quickly and accurately at different stages of PCB design.
Two live sessions are available April 11. Topics include:
- How thermal vias can assist in heat dissipation on a PCB
- How to model thermal vias during development; simple to explicit detailed approaches
- Methods applied to an example model of a component mounted on a PCB with thermal vias
To register, click here.
- Article: PCB thermal design in Automotive Display Clusters
- New Flotherm XT virtual lab: Try CAD-centric smart electronics cooling 30 day free trial
Incl. updated real world models (ADAS cameras + Drone quadcopter, IGBT calibration) and tutorials + videos - Video: Reducing thermal simulation time for PCBs using Substitute Layer Analysis
- Article: 6 Sigma methods applied to electronics cooling design
Suggested Items
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.