-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Kulicke & Soffa to Exhibit at SMTconnect 2019
May 7, 2019 | Business WireEstimated reading time: 1 minute
Kulicke & Soffa Industries, Inc. is exhibiting at the SMTconnect 2019 trade show in Nuremberg, Germany, from May 7 through 9, 2019.
Kulicke & Soffa’s latest flexible Electronics Assembly (EA) equipment will debut at the trade show along with other range of assembly and packaging solutions in Hall 4A, Booth #440. Apart from delivering high accuracy, maximum versatility with maximized feeding space, the new EA equipment has an improved and unique SlimFit Feeding system, which improves the handling, uptime and reduces change over significantly. The system supports industry 4.0 applications, via the IoT Box for performance monitoring as well as material management and traceability. Along with the equipment is a facial recognition system which offer fast and touchless high-speed authentication access to the system.
Other recently introduced K&S’s solution such as the RAPID Pro GEN-S series ball bonder, Asterio hybrid wedge bonder, consumable materials and tools will also be showcased. In addition, the iFlex T2 equipment will be featured as part of the IPC CFX showcase with real-time demonstrations at K&S’s booth.
Joeri Durinckx, Kulicke & Soffa’s Senior Director for EA/APMR Business Unit, said, “With the emerging needs of cybersecurity in the smart manufacturing environment, the use of advanced sensor technology, such as facial recognition, will reduce human dependency enhancing factory security and efficiency.”
About Kulicke & Soffa
Kulicke & Soffa is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.
Suggested Items
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.