Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Cascade Chapter Designers Council Meeting is June 12
June 6, 2019 | IPC Designers Council, Cascade ChapterEstimated reading time: 1 minute
The Cascade Chapter of the IPC Designers Council will be meeting on June 12. This evening event is free, with dinner sponsored by Mentor. Don't miss out on this great educational opportunity to advance your knowledge and design skills.
The guest speaker is Robert Hanson, and electrical engineer and signal integrity design instructor. He will present Achieving Signal Integrity and Meeting EMI Radiation Requirements Using High-Speed Connectors.
Robert will be showing examples of connectors that have poor control of EMI radiation/immunity, which are also affected by mutual inductance and high signal reflection. Next, examples of adding ground pins will be shown that in turn enhance capability. The ground blade connector will be shown with different signal/ground pin configurations to show comparative transmission capabilities. Two widely used high-speed connectors for circuit cards and backplanes will be compared. A method to interface a connector to a land trace to eliminate reflections will follow. Finally, a connector that passed radiated emissions up to 500MHz will be discussed.
Date
Wednesday June 12, 2019
Time
6:00 - 8:00 pm
Location
Lake Washington Institute of Technology - Kirkland Campus. The meeting will be held in room A102 in the Southeast corner of the building on the 1st floor.
This event is free, but donations are greatly appreciated. Please RSVP no later than 8 p.m. on Tuesday, June 11.
To RSVP, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.