Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
New Book Examines Critical Need for Proper PCB Documentation
July 26, 2019 | I-Connect007Estimated reading time: 1 minute
Bring your knowledge of PCB documentation into the 21st century with The Printed Circuit Designer’s Guide to… Documentation—the latest title in our educational library.
The Printed Circuit Designer’s Guide to… is an ongoing series specifically dedicated to educating printed circuit board designers and serves as a valuable resource for people seeking the most relevant design information available.
When the PCB layout is finished, the designer is still not quite done. The designer’s intent must still be communicated to the fabricator through accurate PCB documentation. Documentation can be an error-prone task—one that may take up to 20% of the total PCB design cycle time. Many designers still utilize documentation strategies that date to the ‘80s and ‘90s. Mark Gallant of DownStream Technologies explains how today’s solutions can eliminate post-processing errors and speed up time to market.
Kelly Dack—CID+, CIT, EPTAC—said, “This book will teach you to save time and money, reduce frustration, and make your job easier.” This book is also a must-read for any PCB designers or design engineers who would like to adopt 21st-century documentation processes.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Documentation.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Share on:
Suggested Items
Green Circuits Expands Large-Format PCBA Capabilities with Installation of JUKI Primo Screen Printer
05/05/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces the installation of the JUKI Primo Large-Format Screen Printer, expanding its capabilities to support printed circuit board assemblies (PCBAs) up to 33.5" x 24".
ASC Sunstone Circuits to Exhibit at PCB Detroit 2025
05/05/2025 | ASC SunstoneASC Sunstone Circuits will be exhibiting at the inaugural session of PCB Detroit to be held on June 2 and 3 on the campus of Wayne State University.
HyRel Technologies Celebrates Future Innovators: Intern Program Empowers the Next Generation of Engineers and Professionals
05/01/2025 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
05/01/2025 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).