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SMTA and I-Connect007 to Hold Conference on Additive Electronics
August 22, 2019 | SMTAEstimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA), in cooperation with I-Connect007, will be holding a one-day conference focused on additive electronics.
Scheduled to be held on October 24, 2019 in San Jose, California, the four-session conference titled “Additive Electronics Conference: PCB Scale to IC Scale” is designed to not only showcase options and processes intended to enable line width and space from 0.003” to 5 microns, but also to provide information on supporting materials and processes that are being developed to serve all market segments and expose attendees to other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.
Session Snapshot
The conference will be divided to the following sessions:
- Session 1: The Need for Additive
- Session 2: Materials & Technology
- Session 3: Practical Applications
- Session 4: Interactive Panel Discussion
Those who are or expect to be facing the challenges of the need for very high-density interconnect and are interested in learning about options available in the market to enable line width and space below 75-micron feature size should attend the conference.
The registration is now open, and the early registration deadline is on September 27, 2019.
For more information on the conference sessions, click here.
To register, click here.
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