-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
TowerJazz, Cadence, and Kyiv Polytechnic Institute (KPI) to Open First Analog Design Lab
January 23, 2020 | Business WireEstimated reading time: 2 minutes
TowerJazz, the global specialty foundry leader, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, Inc., today announced a collaboration to open a new analog circuit design lab in Ukraine. The first-of-its-kind lab and corresponding program was formed to provide designers and high-level engineering students with unparalleled access to tools and expertise in IC design.
The lab, at the prestigious KPI University, is equipped with advanced hardware and software design tools, providing the most up-to-date setting for analog circuit designers. The collaboration between the three parties sets the grounds for the next generation of analog electrical engineering experts to perfect their skills. In addition, students gain exclusive direct access to TowerJazz’s analog process as reflected in the company’s PDK, allowing hands-on practical experience with silicon manufacturing. TowerJazz plans to sponsor and allow select students to run post-silicon projects, exposing them to a full-circle experience of the design-to-product process.
“We are very excited to announce the availability of this exclusive program to our students. Our collaboration with TowerJazz and Cadence allows us to enhance our academic portfolio in analog design techniques.” said Mykhaylo Zgurovsky, Rector of the National Technical University of Ukraine ‘Igor Sikorsky Kyiv Polytechnic Institute’. “We believe this activity will cultivate a profound VLSI community in Ukraine. The hardware and software of this lab will enable our higher degree students and teachers to obtain Cadence certificates in the modern analog design system.”
This initiative opens up new possibilities for all levels of trainings from B.A.s, M.A.s, and up to Ph.Ds, at KPI’s Faculty of Electronics. By providing targeted training and allowing realization of academic studies projects, this program involves Igor Sikorsky KPI students in joint research projects with industry players.
“We are very excited to announce our distinctive collaboration with KPI and Cadence and to be setting new grounds for design expertise. Enabling access to our state-of-the-art design enablement kits, along with Cadence leading software tools and the KPI team of experts, we can effectively train a new generation of analog designers,” said Ori Galzur, Vice President of VLSI Design Center and Design Enablement, TowerJazz. “By becoming familiar with TowerJazz’s analog PDK and process, program graduates can potentially have a gateway to joining our dedicated and experienced worldwide design enablement team.”
“Cadence is committed to supporting academic institutions, and our work with TowerJazz and KPI is geared toward developing a lab for practical, high-level design academic studies,” said Yoon Kim, Vice President of Business Development, Head of Cadence Academic Network. “Our technology and expertise, together with the TowerJazz PDK, provide students with a modern analog academic foundation and advanced tools needed to achiev Cadence logoe system-on-chip design excellence so these future engineers can hone the necessary skills required to succeed after graduation.”
Grand opening ceremony will take place January 30, 2020, at the KPI campus and will feature sessions by executives from all parties.
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.