Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
MacDermid Alpha Promotes ALPHA® SnCX Plus 07 Alloy as New Solution for Moderately Complex Assemblies
May 11, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, promotes its ALPHA SnCX Plus 07 silver free and lead free wave solder alloy as a new solution for moderately complex assemblies.
ALPHA SnCX Plus 07 is a high performance, low cost wave and selective soldering alloy for use on simple to moderately complex dual-sided assemblies. The alloy exhibits high mechanical reliability and excellent hole fill properties enabling best-in-class performance for moderately complex assemblies. Being silver free, ALPHA SnCX Plus 07 is a cost-effective alternative to silver-bearing alloys and can significantly reduce an assembler’s total cost of ownership without sacrificing soldering and reliability performance.
“ALPHA SnCX Plus 07 delivers superior performance over many of the popular tin copper solder alloys. Many companies assembling dual-sided, multi-layer boards up to 2.4 mm thick are already realizing the benefits of using SnCX Plus 07,” said Bernice Chung, Portfolio Manager for Wave Solder Assembly Solutions at MacDermid Alpha. “Many of our customers have realized substantial cost savings after switching from other popular SnCu based alloys to ALPHA SnCX Plus 07, particularly in the areas of dross reduction and energy savings, as a result of being able to use lower pot temperatures. All assemblers should consider the value that switching to ALPHA SnCX Plus 07 could create for their process.”
For more information on ALPHA SnCX Plus 07 please visit MacDermidAlpha.com
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.