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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Essentra Components Advise on Efficient PCB Design With New Free Guide
June 16, 2020 | Essentra ComponentsEstimated reading time: 1 minute
Essentra Components know that the performance of your circuit will depend greatly on how it’s laid out on the PCB, and that poor PCB layout can cause function and reliability problems. To save time and problems they suggest therefore that designing your PCB needs to start before the actual process of ideation, definition and validation.
This updated Essentra Components guide to efficient PCB design shows how you can improve the overall product by allowing electronic design engineers to ensure compatibility among the project hardware. The guide is available at www.essentracomponents.com.
They suggest that design and prototyping should begin with consideration of the design software, fabrication and component density, then matters of trace width calculation and a choice of SMT or Through Hole technology. The guide addresses how to avoid errors in landing patterns, deal with component fit, consider the positioning of specialist components such as decoupling capacitors, so leading on to optimising the layout of switching regulators and concerns of blind and buried vias.
They offer free component samples and free download of component CAD designs as well as other related articles for free download.
- Three Top Tips for Selecting PCB Spacers
- Three trends impacting smart home security industry
- Plastic to play a key role in 5G phone networks
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Julia McCaffrey - NCAB GroupSuggested Items
Zuken Launches GENESYS 2026 to Broaden Access and Improve MBSE Workflows
04/28/2026 | ZukenZuken announced GENESYS 2026, the latest version of its model-based systems engineering platform, with updates designed to improve performance, expand access to model-based information, and enhance the day-to-day modeling experience for engineering teams.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Cadence Reports Q1 2026 Financial Results
04/28/2026 | Cadence Design SystemsCadence had a strong start to 2026, delivering a solid Q1 with accelerating AI demand and record backlog, reflecting strong customer commitment to our AI-driven portfolio,” said Anirudh Devgan, president and chief executive officer.
Tomachie Launches AI-Powered PCB Analysis with Smart Test Point Insertion
04/28/2026 | TomachieTomachie announced its AI-Assisted PCB schematic design analysis platform, enabling engineering teams to evaluate and improve schematic quality before layout begins. Schematic errors caught after layout — or in production — cost 10 to 100 times more to fix than those caught during schematic capture.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).