Connect the Dots: How to Avoid Five Common Causes of Board Failure
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Samtec Teams With SnapEDA to Deliver Symbols and Footprints
July 28, 2020 | SnapEDAEstimated reading time: 1 minute
Samtec now has over 200,000 symbols and footprints for its products to accelerate the design process for engineers.
Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints. Samtec and SnapEDA have teamed up to make these models readily available to engineers, because they both believe that engineers deserve the best in terms of ease-of-use, quality, and convenience.
In the second quarter of 2020, SnapEDA created over 120,000 new Samtec connector models, including high-speed and micro-pitch board-to-board, edge card, and rugged connectors. With these new connector models, engineers can now easily discover, and design-in Samtec products.
“Samtec is an inspiration when it comes to their dedication to the customer experience. Whether it’s their 24-hour free sample program, or their endless pursuit to expand the availability of design resources for their products, Samtec is truly world-class. These new models are yet another example of that dedication to their customers,” said Natasha Baker, CEO and founder of SnapEDA, based in San Francisco.
Connector models are highly sought-after by engineers, because they are incredibly time-consuming for which to create models. This is due to their non-standard bodies, custom solder stencils, fine pitches, irregular pad shapes, and cutouts. Accordingly, connectors are the third most popular category of components on SnapEDA.
“SnapEDA’s commitment to quality, innovation, and ease of doing business has made them a great partner for Samtec as well as our partners in the digital channel. They’ve enabled us to better serve our customers by offering quick and immediate access to hundreds of thousands of our most popular parts,” said Ashley Quinlan, Strategic Marketing Director at Samtec.
All models can be downloaded from Samtec’s website, samtec.com. They are also available on SnapEDA's site, snapeda.com, as well as through over a dozen of its collaborators including Digi-Key and Mouser Electronics.
Formats supported include Cadence OrCad, Allegro, Altium, Autodesk Eagle, Mentor PADS, KiCad, PCB123, and Proteus.
These new, high-quality models were created by SnapEDA’s Component Engineering team using proprietary, patented technology. They include accurate assembly, silkscreen, and contoured courtyards, and follow Samtec’s recommended PCB layouts and stencil patterns. Through-hole pads follow IPC-2221 standards using nominal drill hole sizes.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/03/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.