-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
C.R. International Inc. Expands Capability with ASM’s E by SIPLACE Platform
September 17, 2020 | ASMEstimated reading time: 1 minute
Continuing to lead in the North American mid-speed placement sector, ASM’s E by SIPLACE was again selected over competitive systems for its flexibility and expansive range of high-performance features. C.R. International Inc. (CRI), a long-time SIPLACE customer and trusted Mil/Aero EMS provider, cited the platform’s 01005 component placement capability, changeover simplicity and real-time component teach function as top factors in its E by SIPLACE investment decision.
CRI’s success with complex, high-reliability assemblies has earned the company a reputation as a trusted, knowledgeable partner for customers requiring IPC Class 3 assemblies, which are defined as products where continued high performance or performance on-demand in harsh environments is required. These applications represent close to 95% of the Laurel, MD-based EMS’ business, which includes PCB assemblies for satellites, space flight systems and, more recently, full flight products. As a high-mix, low-volume NPI and prototype specialist, CRI’s equipment set has to be flexible for a variety of product parameters, facilitate off-line set-ups for quick changeover, and be able to accommodate exceptionally challenging, high-technology board builds.
“I’ve been a SIPLACE user for over 30 years,” shares CRI President, Jeff Neisess. “With our recent qualification for full flight systems, it was imperative that we add next-generation placement technology that aligned with our financial and quality objectives. Given our product mix, we knew we needed an extraordinarily flexible system and other suppliers simply could not deliver. E by SIPLACE ticked all the boxes.”
Possessing many of the advanced technologies inherent with ASM’s high-volume SIPLACE systems, E by SIPLACE also comes at a price point that addresses the mid-speed, high-mix market’s operational realities. Ideal for manufacturers like CRI, where multi-product, high-complexity, frequent-changeover protocols are the norm, E by SIPLACE is a single gantry system that can be configured with a variety of placement heads to align with dynamic environments. The CRI system leverages the SIPLACE CP12/PP combination head, delivering placement accuracy of 30 µm on a broad component spectrum – from 01005s up to parts as large as 45 mm x 87.5 mm. Feeder capacity in a high-mix environment is another key consideration and E by SIPLACE’s 120-slot, intelligent feeder technology and offline component tables allows for multiple job set-ups and simple, fast changeover. These features, in addition to programming software ease-of-use, bring CRI’s productivity and future technology capability to a new level.
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.