Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26

06/12/2026 | TrendForce
TrendForce's latest investigation into the foundry industry reveals that strong shipments of AI HPC chips and related components continued throughout 1Q26.

NOTE's Kasdon Electronics Expands UK Footprint with New Investment in Wolverhampton

06/10/2026 | NOTE
Kasdon Electronics, a NOTE company, invests in Wolverhampton and strengthens its UK operations.

NVIDIA Joins Windows on Arm, Driving Arm-Based AI Notebook Share to 34.2% by 2029

06/04/2026 | TrendForce
TrendForce’s latest research reveals that the current AI notebook market is primarily driven by Intel, AMD, Apple, and Qualcomm.

NOTE Opens New Torsby Plant to Boost Sweden's Defence and Critical Sector Supply

05/27/2026 | NOTE
NOTE has inaugurated a state-of-the-art manufacturing facility in Torsby, Sweden, reinforcing its long-term commitment to delivering technical excellence, local production capacity, and supply chain resilience across defence and other critical sectors.​​​​​​​​​​​​​​

What Heterogeneous Integration Means for EMS Providers

05/14/2026 | Nolan Johnson, I-Connect007
Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in