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Free Online Seminar from SEHO and STANNOL to Discuss Water-Based Fluxes
February 25, 2021 | SEHOEstimated reading time: Less than a minute

Innovative technology, practical know-how and the optimization of production processes are the bedrocks of consistently high product quality and sustainable reduction of production costs.
This is what drives the Technology Trend Day from SEHO and STANNOL. This digital event will take place on Tuesday, March 16, 2021.
Short and to the point, the Technology Trend Day will provide practical knowledge for using water-based fluxes: Which benefits do they offer, what has to be considered upon changing the process, and how can the manufacturing equipment avoid assembly line output loss.
All participants are welcome to discuss their questions in the concluding expert round table.
The digital Technology Trend Day will be the first in a series of digital events that SEHO will hold in 2021.
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DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
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Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
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OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.