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New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond
March 11, 2021 | I-Connect007Estimated reading time: 1 minute

Increasing board complexity is driving the need for accurate and speedy inspection systems. In The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond, author Brent Fischthal takes readers through a brief history of SMT inspection before discussing the benefits of data-driven analytics and how intelligent software solutions can help companies analyze and optimize the production process.
In this latest title from I-007eBooks, readers will learn how artificial intelligence has demonstrated promising potential in this field and has far-reaching applications within the manufacturing sector.
According to Michael Ford, Senior Director of Emerging Industry Strategy for Aegis Software, “This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection.”
Download your free copy today!
You can also view other titles in our full library. The Printed Circuit Assembler’s Guide to… series is specifically dedicated to educating the printed circuit board assembly (PCBA) sector and serves as a valuable resource for people seeking the most relevant information available.
We hope you enjoy The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-8)
Suggested Items
Advint Delivers Advanced Electroplating Training to Triangle Labs
06/02/2025 | Advint IncorporatedDuring the last week of April, Advint Incorporated conducted a comprehensive two-day on-site electroplating training session for the technical team at Triangle Labs, Inc., a key innovator in the printed circuit board space. The training was structured to align with the demands of high-reliability plating processes suitable for RF and high-frequency substrates.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
atg Luther Maelzer Announces Grand Opening of New Office and Manufacturing Facility
06/02/2025 | atg Luther & Maelzer GmbHAtg Luther Maelzer, a leading supplier of electrical testing solutions for the PCB industry, recently celebrated with a grand opening of their new office and manufacturing facility in Wertheim, Germany.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
High-frequency EMC Noise in DC Circuits
05/29/2025 | Karen Burnham, EMC UnitedEMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.