-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Keysight Massively Parallel Board Test System Selected by LACROIX
June 29, 2021 | Business WireEstimated reading time: 2 minutes
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced that LACROIX Electronics has deployed the company’s i7090 Massively Parallel Board Test System in their automotive printed circuit board manufacturing facility to reduce labor costs and improve throughput.
LACROIX Electronics specializes in the design and production of electronic assemblies and sub-assemblies and manufactures more than one million automotive printed circuit boards (PCBs) annually. As more components are embedded in PCBs, complexity increases as multiple systems are needed to perform in-circuit test (ICT), programming and functional testing.
Today, LACROIX is building on its competitiveness in the traditional markets for industrial electronic systems and aims to meet the specific challenges of promising new markets such as mobility and industrial IoT. For instance, in France, LACROIX is building a 4.0 factory of the future (Symbiose project), a symbol of the European industrial renewal. To support their growth initiative in Poland, Keysight provided LACROIX with the efficient and flexible i7090 Massively Parallel Board Test System.
“Through this partnership with Keysight, we are aiming for LACROIX to become a pioneer in the implementation of innovative solutions in the field of in situ testing, with the objective of obtaining significant productivity and ROI gains,” explains Vincent Airiau, test engineering corporate manager for the Electronics activity of LACROIX. “The results we are noting after 8 months of testing are already very encouraging”.
Keysight’s i7090 enabled LACROIX to evaluate and test in parallel, reducing labor costs and improving throughput with a smaller footprint that allowed LACROIX to replace two offline ICT testers and two programming stations.
The Keysight i7090 Board Test System is designed to test PCBs quickly and at a low cost per unit tested. With up to 20 parallel test cores and 160 simultaneous flashing channels, the Keysight i7090 offered LACROIX a custom to fit for their exact requirements. Delivering flexible scalability with extensible instrumentation and switch fabric, Keysight’s i7090 allows LACROIX to scale as their needs grow, while test resources configuration can be modified as needed.
“Massively parallel computation cores enable modern computers to deliver breakthrough performance. The i7090 board test system brings a similar capability into printed circuit board assembly (PCBA) manufacturing test and programming,” said Christopher Cain, vice president of Keysight Technologies Electronic Industrial Products. “The i7090 has an innovative modular architecture that delivers breakthrough throughput in a small footprint. It is infused with state-of-the-art Industry 4.0 automation and analytics to deliver unparalleled capability that can be optimized for a broad variety of high-volume PCB assembly manufacturing challenges.”
Suggested Items
DuPont Announces Additional Directors for the Planned Independent Electronics Company
04/18/2025 | DuPontDuPont announced that Karin De Bondt and Anne Noonan will become members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont, which is targeted for November 1, 2025.
Navigating Robotics Deployment Challenges with SINBON
04/18/2025 | PRNewswireIn spite of the potential for robotics technology to expand productivity, several implementation challenges continue to stand in the way of more widespread adoption.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.