-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
April 17, 2025 | BUSINESS WIREEstimated reading time: 1 minute
As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio. This expansion into Northeast Ohio marks a significant step in fostering academic and industry collaboration to accelerate innovation and workforce development in the U.S. semiconductor sector.
“This acquisition supports our mission to expand U.S. semiconductor capacity with secure, high-reliability solutions,” said Marti McCurdy, CEO of Spirit Electronics. “Partnering with LCCC allows us to invest directly in the future talent pipeline and emerging technologies that are critical to national security and domestic innovation.”
Located within the LCCC campus, SMART Microsystems will serve as a hub for advanced research and education in materials, MEMS, and advanced packaging technologies, including 2.5D and 3D integration.
“We are proud to collaborate with Spirit Electronics to bring new opportunities to Northeast Ohio,” said Dr. Marcia Ballinger, President of Lorain County Community College. “This partnership enhances our ability to prepare students for high-tech careers while contributing to the growth of a robust semiconductor ecosystem in our region and beyond.”
Together, Spirit Electronics and LCCC are laying the foundation for a resilient, innovation-driven semiconductor future.
Suggested Items
ESIA Statement on EU Funding for Competitiveness: A New Approach is Needed
05/09/2025 | ESIAThe European Semiconductor Industry Association (ESIA), representing the European leadership in semiconductor research, design, and manufacturing, would like to underscore the need for targeted and sustained investment to strengthen Europe’s strategic sectors.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
German Government Issues Final Funding Approval For New Infineon Fab In Dresden
05/08/2025 | InfineonInfineon Technologies AG has received final approval for the funding of its new plant in Dresden (Smart Power Fab) from the German Federal Ministry for Economic Affairs.
Jenoptik Fab Officially Inaugurated in Dresden
05/07/2025 | JenoptikJenoptik manufactures micro-optics for the semiconductor equipment industry in a state-of-the-art production environment.
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
05/07/2025 | StratEdgeStratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.