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NOTE Growing Further with a New Customer within Greentech
September 6, 2021 | NOTEEstimated reading time: 1 minute
NOTE has signed a partnership agreement with Ferroamp, which is a listed fast-growing Greentech company that offers unique energy- and effect optimizing solution for real estate. NOTE will manufacture the EnergyHub unit, which is the core of the smart system that integrates renewable energy, electric vehicles, energy storage, and connections to the grid in buildings. The batch production is expected to start during Q4 this year at NOTE’s plants in Norrtälje and Pärnu. The conditions are deemed to be good that the partnership with Ferroamp will develop positively in terms of volume.
“NOTE continues to develop strongly with very high growth and increased profitability. An important success factor is our methodological investment in developing high quality and delivery precision in our services. It is gratifying that we have also gained trust and won this exciting new deal with Ferroamp”, says Johannes Lind-Widestam, CEO and President.
“The partnership with NOTE is an important step in our continued industrialization of the company, when we go from being limited by the production to scalable volume production. The partnership with NOTE, which is a well-established electronic contract manufacturer, provides us the capacity to grow our business further, both on the domestic and international markets”, says Krister Werner, CEO at Ferroamp.
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Rachael Temple - AlltematedSuggested Items
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Delta Electronics Posts 26.7% Growth in Sales Revenues for August
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Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.