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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Now Playing: Part 3 of 'Predicting Reliability in Electronics' Micro Webinar
December 1, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch & Learn!
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The third episode, “ECM Examples,” can be viewed in under five minutes. Presenters share information on ECM types, including examples from Bosch, HP, and NP. Presenters also discuss ECM requirements and more.
Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
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05/06/2024 | New Yorker Electronics Co.New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League Electronics, renowned manufacturer of interconnect products.
AT&S Brings High-Tech to the Museumsquartier
05/06/2024 | AT&SAT&S, as a “MQ goes Green” partner, has prepared special highlights for the occasion: Visitors aged eight and above can embark on an interactive journey through the fascinating world of microelectronics.
May Issue of SMT007 Magazine: Coming to Terms With AI
05/06/2024 | I-Connect007 Editorial TeamIn the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).