Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Dixon, Rexxam Sign JV Agreement
January 21, 2022 | DixonEstimated reading time: Less than a minute
Dixon has entered into Joint Venture Agreement (JV Agreement) with Rexxam Co. Ltd. (Rexxam). Pursuant to the said JV Agreement, Dixon Devices Private Limited (JV Company) will be 40% owned by Dixon and 60% owned by Rexxam. The JV Company has received approval under PLI scheme of Government of India under White Goods category and in accordance with the same, it will undertake manufacturing of Printed Circuit Boards for Air-Conditioners (PCBA) for the domestic and international market.
Commenting on this occasion, Atul B. Lall, Vice Chairman & Managing Director, stated that “We are immensely grateful by the trust that Rexxam has bestowed on Dixon for this collaboration. Through this partnership, we are taking a leap in our long standing relationship of 7 years with Rexxam. The JV Company will cater to customers of Rexxam for both domestic and export markets. With Dixon’s excellent record of manufacturing and Rexxam taking the lead in marketing and sales, we are positive that this partnership will be well-positioned and a key player in this space and shall be a contributor in strengthening India’s electronics manufacturing sector as well as towards Indian government’s vision of an Atmanirbhar Bharat”.
Share on:
Suggested Items
Indian Government Establishes Panel for New National Manufacturing Mission
05/14/2025 | I-Connect007The Indian government has set up an inter-ministerial committee to design the primary plan for a new national manufacturing mission, India’s Economic Times reported on May 12.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
From DuPont to Qnity: A Bold Move in Electronics Materials
05/14/2025 | Marcy LaRont, I-Connect007DuPont has announced the intended spinoff of a public independent electronics company, Qnity, which will serve as a solutions provider to the semiconductor and electronics industries to enhance competitiveness and innovation in advanced computing, smart technologies, and connectivity. In this interview, Jon Kemp, Qnity CEO-elect and current president of DuPont’s Electronics business, shares his insights on the strategic separation from DuPont.
Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?
05/13/2025 | I-Connect007 Editorial TeamIn response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.