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GEN3 Webinar Concludes With Release of Part 11: Historical Background
February 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The final episode, “Historical Background” can be viewed in just under seven minutes. Presenters discuss IPC and the DoD, IEC, and provide summary recommendations and reference materials.
Visit Predicting Reliability in Electronics and start watching, free, today!
According to Andy Levesque, principal electrical engineer at Gentex Corporation, "Predicting Reliability in Electronics is a nicely put together series. SIR can be a dry subject, and the pace of the short episodes were very well done. I wish I’d had access to this when I started working with SIR earlier in my career."
Designed to complement their book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series by GEN3 can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.
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