-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Presents Sinter Technology Technical Paper at APEC Power Conference 2022
February 18, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Power Electronics Division of MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in power electronics packaging and assembly, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Houston, Texas.
As sintered silver technology continues to replace traditional solder materials for die attach applications, the bottleneck for further inverter reliability improvement is shifting to the heat sink level. Direct cooled pin-fin modules, without baseplate and thermal grease, have been shown to have lower thermal resistance. In this paper, Gyan Dutt, Global Portfolio Manager for Power Electronics, will introduce a novel large area dispense process for silver sintering paste application that is particularly suited for transfer-molded power packages.
Dutt will define the application process steps, review the results of assembly characterization, and discuss reliability improvements by silver sintering (over solder) with commercially available SiC MOSFET modules. “Module to heat sink sintering, along with sintered die top attach, is the next frontier for further reliability and power density improvements for EV traction power modules and inverters. The system level benefits in weight savings and cooling requirements will propel the use of sintering technology throughout the power assembly stack, especially for high end EVs,” comments Dutt.
The paper will be delivered on Wednesday, March 23, 2022 at 5:10 – 5:45 pm.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.