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EVS International Signs on Competitive Edge Solutions in New England
April 13, 2022 | EVS InternationalEstimated reading time: 1 minute
EVS International, the leader in solder recovery, is pleased to announce that it has signed on Competitive Edge Solutions, LLC as its newest manufacturers’ representative. Dave Wilson, President, will represent EVS throughout the six New England states (MA, CT, RI, VT, NH, ME).
Understanding process/product needs and selecting the right equipment is critical to the success of your business. Competitive Edge Solutions has the resources to help your company gain an advantage, enhance a process, or develop a solution to a problem.
Competitive Edge Solutions has more than 25 years of practical experience in providing industry-leading equipment to exceed its customers’ needs. Dave Wilson, President of Competitive Edge Solutions, remarks “EVS International’s industry-leading solder recovery systems provide a unique solution to the high cost of materials, specifically Pb Free alloys, in a time of need. As the cost of alloys go up, every manufacturer can actively reduce their operating costs by utilizing this simple, easy to operate system. Let us show you how it works and the fast ROI it will produce.”
EVS’ new Solder Recovery Systems are fully lead-free compatible. Lead-free solder is used around the world and many EVS customers are using the EVS Solder Recovery Systems on all types of lead-free alloys (SAC305, SN100C and SAC X ECT).
The price of lead-free solder is three to four times that of present leaded solder so that the savings and payback from using EVS technology has leapt forward, making solder recovery the fastest payback of all circuit board assembly capital purchases.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
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AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
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Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.