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Indium Corporation Features High-Reliability Auto Products at SMTconnect
April 27, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature selections from its portfolio of high-reliability automotive solutions at SMTconnect, May 10-12 in Nuremberg, Germany.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the increasingly rigorous demands of high-reliability applications – including the automotive and rapidly-evolving electric vehicle markets – such as its suite of Rel-ion™ technology solutions for e-Mobility. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging automotive challenges.
Indium Corporation’s LV2K is an ultra-flat, flux-coated solder preform that produces lower voiding and solder joints with better reliability as compared to conventional solders. Coupled with an improved coating process, LV2K can be controlled well within the standard 0.5% by weight tolerance limit and ensures a complete and uniform coating. Its capabilities covers most geometries and sizes, and allows for a precise flux content to minimize volatiles while removing surface oxides. LV2K is a drop-in solution that delivers:
- Ultra-low voiding
- Precise control of the flux percentage
- Improved thermal management, structural integrity, and overall end-product reliability
Indium8.9HF solder paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
Indium8.9HF:
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- Excellent response-to-pause, even after being left on the stencil for 60 hours
- Enhanced printing and reflow performance after remaining at room temperature for one month
- Consistent printing performance for up to 12 months when refrigerated
- Offers excellent pin-in-paste and through-hole solderability
- Resists premature flux spread to prevent surfaces from oxidizing
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.