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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
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IPC Training Course on PCB Design for Printed and Wearable Devices
May 27, 2022 | IPCEstimated reading time: 1 minute
IPC will be holding a training course on PCB design for printed and wearable devices. The course will be held every Mondays and Wednesdays, 6:30 p.m. to 8:30 p.m., starting from June 6 to July 18, 2022.
This course aims to provide the skills necessary to create designs for printed electronics and wearable technologies in accordance with IPC standards. Taught by an IPC-certified industry expert with more than 25 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and projects to facilitate mastery of the key concepts required by circuit board designers.
The program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design. Upon completion, participants will be able to design boards for printed electronics and wearables; understand the trade-offs in materials used in these applications; define a board stack-up with structures that meet the needs of these designs and mitigate signal integrity issues for these designs.
Attendees will also be able to define the effects of mechanical retention needs for these applications; implement component footprint and packaging methodologies; mitigate thermal effects; and employ the documentation requirements for these designs.
For more information visit IPC’s website.
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