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October Issue of PCB007 Magazine Available Now
October 17, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The PCB imaging process has evolved quite a bit over the last six or seven decades, from screening to liquid photoresist to dry film and then to aqueous dry film. Now laser direct imaging has created a world of possibilities that were unthinkable with film.
Of all of the process steps in a fabrication cycle, imaging may be the most critical. There are many variables to deal with in imaging, making best practices of solid data collection and analysis a must.
In the October issue of PCB007 Magazine, our experts discuss ways for the readers to fine-tune their imaging process by understanding how etching, plating, and imaging all work together.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
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Avnet Launches QCS6490 Vision-AI Development Kit
05/17/2024 | AvnetThe QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products.
Standard of Excellence: Collaboration—The Right Path to Innovation
05/15/2024 | Anaya Vardya -- Column: Standard of ExcellenceNow more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.
Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper
05/16/2024 | I-Connect007In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
05/14/2024 | I-Connect007 Editorial TeamDo you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.
IDENTCO Highlights Automation Capabilities and PCB Labeling at PCB East
05/13/2024 | IDENTCOIDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will highlight its automation capabilities and PCB labeling solutions at PCB East, June 4-7 in Boxborough, MA, Booth #301.