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EMA Design Automation Announces New Support+ Program for Cadence Customers
November 9, 2022 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation, a full-service provider and innovator of Electronic Design Automation (EDA) systems solutions, is pleased to announce the launch of the EMA Support+ program. This new benefit is available to all EMA customers on active maintenance and includes unique offers and tools to help engineers get the most from their Cadence design software. The program includes:
- Access to EMA's new Knowledgebase with solutions, tips, and guides
- Discounted access to EMA E-learning with over 100 hours of training
- The EMA Toolkit featuring integrated apps to improve efficiency
“EMA has been delivering world class EDA support for over 30 years,” said Manny Marcano, President and CEO of EMA Design Automation. “We are very excited to be able to offer this benefit as another example of the unique value EMA brings to the engineering community worldwide.”
Featured within the EMA Support+ program is the EMA Toolkit; a collection of apps designed to improve user productivity and help designers get their boards done right the first time. Version 1.0 of EMA Toolkit consists of 5 apps:
- Find in Design - Quickly scan multiple designs to find where specific components are used
- CircuitFit - Calculate and analyze board space occupied by components before committing to layout
- PCB Clustering - Advanced PCB placement and clustering for faster more efficient layout
- Highlight Part by Property - Automatically color-code parts by properties for easy identification
- CIS BOM Template - Easily generate a fully formatted and branded BOM from CaptureCIS
“We are just getting started,” said Manny Marcano. “The team has great plans ahead for this program to keep adding value for our customers.”
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05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.