-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 18, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

We’re heading into the holiday season, and tradeshow season is in full swing. Managing Editor Nolan Johnson and technical editor Pete Starkey have spent the week in Munich covering electronica, and apparently the attendance was wunderbar. COVID still persists, but everyone is ready to return to some normalcy.
There’s a lot going on in our industry. In this week’s roundup, we have articles on everything from rigid-flex to the supply chain, as well as a primer on the role of physics in PCB design. As we move into the new year, you should check out this Top 10 list of tech trends for 2023, courtesy of Gartner.
I hope all my friends in the colonies have a Happy Thanksgiving!
Electronica: Picking Up Where We Left Off
Published November 18
Are industry events getting back to some semblance of normalcy? It’s looking that way. The last few events we’ve covered have posted good attendance numbers, and the electronica show in Munich kept that positive vibe going, as Nolan Johnson explains here. Let’s hold a good thought for next year’s conferences and trade shows.
The Physics of PCB Design
Published November 17
There’s been a bigger focus on the fundamentals of physics lately, as issues like thermal management become more prevalent. But do PCB designers really need to understand Maxwell’s equations and Ohm’s law? We have a great interview with Eric Bogatin, who explains how designers can learn the fundamentals of physics without letting the math “get in the way.”
Gartner Identifies the Top 10 Strategic Technology Trends for 2023
Published November 18
Gartner has been tracking data and trends in the electronics industry for decades, and they seem to get quite a bit right over time. They recently gazed into their crystal ball and released their Top 10 Strategic Technology Trends for 2023. Artificial intelligence figures into three of these predictions, including sustainability. Check it out.
Your Shortage Is Someone Else’s Excess
Published November 16
Remember when excess inventory was a big problem? We’ve been dealing with shortages and long lead times for so long that it’s easy to get tunnel vision about this. In this article, Chintan Sutaria takes a wide-angled look at the supply chain and our almost impossible quest to have neither shortage nor excess of PCB parts. If you feel as if you’re tilting at windmills now, you’re not alone.
DownStream Flexes in Rigid-Flex
Published November 14
In this interview from PCB West, DownStream Technologies’ Joe Clark and Mark Gallant discuss their latest tool updates in the rigid-flex arena, including inter-layer SI analysis. As Joe half-jokingly points out, with this sort of functionality, DownStream may be on its way to becoming an EDA layout software company. Lots of things happening in post-processing now.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/13/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.