Nolan’s Notes: The Work-Life Balance—You’ve Got This
Elementary, Mr. Watson: Why Traces Alone Won’t Save You
Connect the Dots: The Future of Designing for Reality—Electroless Copper
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
November 3, 2025 | Real Time with...SMTAIEstimated reading time: Less than a minute
Marcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
For more coverage from the event, visit the Real Time with... SMTA International 2025 site.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium
11/05/2025 | Real Time with...SMTAIIn this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Akrometrix LLC Reports a Record Year of Revenue for 2024
03/04/2025 | Akrometrix LLCAkrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.
Akrometrix Announces 30 Year Anniversary as Industry Leader in Thermal Warpage Metrology
02/25/2025 | Akrometrix LLCAkrometrix is celebrating their 30 year anniversary as an industry leader in thermal warpage metrology. Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago to address issues in PCB flatness using the shadow moiré warpage measurement technique.