-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Trackwise Announces Board Changes
January 9, 2023 | TrackwiseEstimated reading time: 2 minutes
The Board of Trackwise Designs plc, a leading manufacturer of specialist products using printed circuit technology, is pleased to confirm, following the General Meeting to approve the Fundraising, held on Friday 6 January 2023, the appointment of Andrew Lapping and Chris Pennison to the Board of the Company, as Non-Executive Chairman and Non-Executive Director respectively, with effect from 8:00 a.m. on 9 January 2023.
As announced on 14 December 2022, and included in the Circular to Shareholders dated 15 December 2022, in order to maintain Board numbers and also to control the cost base, Susan McErlain and Ian Griffiths will step down from the Board at the same time. Charles Cattaneo intends to step down from the Board at the end of January 2023. Given the forthcoming departure of Charles Cattaneo, the Company is commencing a recruitment process for an additional new non-executive director.
Andrew Lapping, incoming Chairman of Trackwise, commented: "Today marks a fresh start for the Group after a very tough recent period. I am delighted to take on the challenge of helping to lead Trackwise with my former Hyperdrive CEO Chris Pennison as we join the Trackwise Board. We bring industry experience to the Group with a track record of transitioning smart technology into a commercially viable and successful product. Prior to our participation in the Fundraising, Chris and I undertook significant referencing of the sales pipeline and the core technology. As a result, we believe there is significant potential for Trackwise and its IHT technology in the EV market. Whilst I recognise that the Fundraising has been difficult for existing shareholders, I would urge all to get behind us as we look to exploit the Company's world-class IP and production facilities. I want to close by reassuring all stakeholders that Trackwise has enormous potential but to realise its true value, we have to think and act smart in a very dynamic and rapidly expanding market."
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Sony Semiconductor Solutions, TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership
05/08/2026 | TSMCSony Semiconductor Solutions Corporation and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to form a strategic partnership for the development and manufacturing of next-generation image sensors.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
Molex Completes Acquisition of Teramount Ltd.
05/07/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
IBM, Aramco Explore Collaboration to Accelerate AI and Innovation Across Saudi Arabia
05/07/2026 | IBMAramco and IBM announced their intended collaboration on opportunities to advance artificial intelligence, agentic AI, automation, material science and other mutually agreed domains in the industrial sector.
Foxconn Launches Second-Gen LEO Satellite, Begins Inter-Satellite Link Testing
05/05/2026 | FoxconnFoxconn Technology Group, the world's largest electronics manufacturing services provider, announced that its second-generation low-Earth orbit (LEO) satellites, "Pearl-1A" and "Pearl-1B," were successfully launched into their designated orbits via SpaceX's Falcon 9 rocket on the evening of May 3 (Taipei time).